Wholesale Bulk Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) Supplier

Publisher ‏ : ‎ CRC Press; 1st edition (December 30, 2021)
Language ‏ : ‎ English
Hardcover ‏ : ‎ 304 pages
ISBN-10 ‏ : ‎ 1032160810
ISBN-13 ‏ : ‎ 978-1032160818
Item Weight ‏ : ‎ 1.35 pounds
Dimensions ‏ : ‎ 6.14 x 0.88 x 9.21 inches
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